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SPUTTERING
ARC ION PLATING
Technologies > UBM Sputter
ARC ION PLATING  
 
UBM Sputter (Unbalanced Magnetron Sputter)
The permanent magnet mounted in the cathode generates the magnetic field
that interacts with the electrical field applied to the target. As a result,
the plasma density near the target increases. Due to this effect, the discharge
current increases and the sputter speed is improved.
Especially, the UBM sputter is a device that improves the sputter efficiency
by applying different field strengths to the internal magnet and the external
magnet.
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