HOME / R&D / Inventing technology / UBM Sputter
UBM Sputter
UBM Sputter (Unbalanced Magnetron Sputter)
The UBM sputter is a technology that increases the sputtering efficiency by detailed design the magnetic field strength of the internal and external magnets. The interaction between the magnetic field formed by the permanent magnet mounted on the cathodes and the electric field applied to the target increases the plasma density near the target. High-density plasma increases the discharge current and increases the sputtering efficiency.
METALLION™ is a coating system that uses arc discharge to evaporate the metal target
of the cathode and deposit it on the surface.
Various metal coatings such as TiN, TiCN, TiAlN, and CrN are available depending on the target used.
All specifications of the system are optimized and provided according to the customer's requirements.
Characteristics and Specifications of UBM Sputter
- Able to use alloys, compounds and insulating layers to deposit thin film
- Enable to various reactive sputtering
- Uniformity of the deposition layer
- Large Sputtering Target Enable
- Low temperature process
- Easy to color coatings of oxide and metal nitride
| UBM350 | UBM650 | UBM850 | UBM1050 | UBM1200 | |
| Size (mm) | W100 × H350 | W100 × H680 | W120 × H850 | W120 × H1050 | W120 × H1200 |
| Type of Magnet | Permanent magnet | ||||
| Coating Uniformity | ± 3% | ||||
| Operative Pressure | < 30mTorr | ||||
