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CARBOZEN™

Hybrid coating system combining various plasma sources

We internalize all major plasma technologies from PVD plasma sources such as FCVA (Filtered Cathodic Vacuum Arc),
LIS (Linear Ion Source), and UBM (Unbalanced Magnetron Sputter) sputter to PECVD (Plasma Enhanced CVD).
CARBOZENTM is manufactured by optimizing the combination of plasma sources according to customer requirements.

We internalize all major plasma technologies from PVD plasma sources such as FCVA (Filtered Cathodic Vacuum Arc),
LIS (Linear Ion Source), and UBM (Unbalanced Magnetron Sputter) sputter to PECVD (Plasma Enhanced CVD).
CARBOZENTM is manufactured by optimizing the combination of plasma sources according to customer requirements.

System Specification
Plasma Source FCVA (Filtered Cathodic Vacuum Arc)
LIS (Linear Ion Source)
UBM Sputter (Unbalanced Magnetron Sputter)
PECVD (Plasma Enhanced CVD)
Chamber Size Ø600×H600, Ø700×H900, Ø800×H1000,
Ø1000×H1000, Ø1000×H1200, Custom-made
Jig System 2 fold or 3 fold
Working Gas Mass flow control system
Ar · O2 · C2H2 · CH4 · C6H6 · etc
The Initial
Vaccum Degree		 ~10-6Torr
Bias Power Pulsed DC
Heater Max 250℃ [Optional 450℃]
Process Automatic / Semi-automatic
CARBOZEN-FA
Advantages of Linear Ion Source
  • Maintaining stable ion energy during coating film deposition
  • Uniform coating film formation for large area products
  • Low maintenance costs
  • High adhesion
  • Cleaning using Ar, O2, N2 gas
Deposition Rate 300nm/min
Residual Stress ~ 2.0GPa
Hardness ~ 28GPa
Friction Coefficient ~ 0.1
LIS350 LIS650 LIS800 LIS1000 LIS1200
Size (mm) W102 × H380 W102 × H680 W102 × H840 W102 × H1044 W102 × H1244
Type of Magnet Permanent magnet
Coating effective area 340mm 656mm 790mm 990mm 1190mm
Coating Uniformity ± 3%
Voltage 500 ~ 3000V
Operative Pressure 0.7 ~ 3mTorr
Source Ar, N2, O2, C2H2, CH4, etc
Advantages of UBM Sputter
  • Able to use alloys, compounds and insulating layers to deposit thin film

  • Enable to various reactive sputtering

  • Uniformity of the deposition layer

  • Large Sputtering Target Enable

  • Low temperature process

  • Easy to color coatings of oxide and metal nitride
UBM350 UBM650 UBM850 UBM1050 UBM1200
Size (mm) W100 × H350 W100 × H680 W120 × H850 W120 × H1050 W120 × H1200
Type of Magnet Permanent magnet
Coating Uniformity ± 3%
Operative Pressure < 30mTorr
Advantages of FCVA Source
  • Droplet removal through dual-bent duct filtering
  • Ultra-smooth surface
  • Innovative electrode design with increased plasma beam stability
  • Innovative electrode design for stable plasma beam
  • High adhesion
  • High reproducibility and easy maintenance
FCVA

Single-Filtering

Double-Filtering (Ultra-Smooth)

Scan area : 2x2 um2 , Ra = 0.02 nm

FCVA Source Specification
Single Bent Double Ben
Cathode Material of the Target Graphite
size ø75 x 25(L) nm
Duct size I.D.ø144mm, O.D.ø165.2mm
Angle 45°
Filtration Method Single Double
Magnet Source magnet (SM), Bending magnet (BM),
Output magnet(OM), Raster magnet(RM)		 Source magnet (SM), Bending magnet (BM),
Emission magnet(EM), Output magnet (OM),
Raster magnet(RM)
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