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DLC-coated Lapping Carrier

High Performance DLC-coated Lapping Carrier

Lapping carrier is essential for the planarization and polishing of silicon wafers. Our
DLC coating technology provides excellent wear resistance and chemical stability.

FEATURES

By applying innovative DLC coating technology, our products deliver superior wear and chemical resistance compared to conventional alternatives, while maintaining exceptional cost competitiveness.
With a highly reproducible one-stop process, we manufacture one batch of five lapping carriers as a complete set.

** Product design and manufacturing tailored to each customer’s process requirements.
** Capability to design, build, and supply coating equipment.

OFEATURES

CUSTOMIZED MATERIAL →

CUSTOMIZED MATERIAL

최적 작업조건과
품질 유지를 위한
소재 주문 생산

SHAPING
PROCESS →

SHAPING PROCESS

정밀 Laser
가공 기계

LAPPING →

LAPPING

30B
Lapping
전용 장비

POLISHING →

POLISHING

32B
Polishing
전용 장비

DLC COATING →

DLC COATING

J&L Tech 제작
DLC Coating
전용 장비

INSERT →

INSERT

Insert 금형 &
Routing 장비

INSPECTION

모든 작업 공정에서
J&L Tech 전용
Test 장비로 검사

초저마찰
(S-DLC)

S-DLC

초저마찰에 특성화 된 코팅

전도성
(σ-DLC)

σ-DLC

전기저항 제어가
가능한 코팅

마찰계수제어
(N-DLC)

N-DLC

마찰계수 제어가
가능한 코팅

초고경도
(ta-C)

ta-C

FCVA 기술을 이용한 초고경도 코팅

폴리머수지 이형성
(MIRAGE)

MIRAG

유동성 및 이형성에 도움을 주는 코팅

SPECIFICATIONS FOR 28B AND 30B

** Customizable specifications upon request.

28, 30B Lapping Carrier	Wafer Size	300mm (12”)
	Diameter	ø724mm ~ ø749mm
	Number of Wafer Holes	3ea
	Thickness	777㎛ ± 1.0㎛(Standard)
	Inspection Criteria	Peeling, Scratch not allowed
Body	Material	Stainless Steel 420 J2 (+DLC Coating)
	Hardness	Hv 560 ± 10
	Outer diameter	724m ± 0/-0.3mm(one side)
Insert	Material	PVDF (Black)
DLC Coating	Thickness	2.5 ± 1.0㎛ (one side)
	Diameter	705mm ± 1mm
	Hardness	20.0 Gpa (Nano Identation) = Hv 1,960
	Adhesion Force	25 N (Scratch Tester, Based on SKD11)